公开(公告)号：US20140061841A1

公开(公告)日：2014-03-06

申请号：US13956666

申请日：2013-08-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngbae KIM ,  Hyon-Chol KIM

IPC: H01L31/02

CPC classification number: H01L31/02 ,  H01L24/32 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package including a substrate including an epoxy-based material, an image sensor chip mounted on the substrate, and an attaching part provided between the substrate and the image sensor chip may be provided. The attaching part may include a first attaching part, and a second attaching part provided around the first attaching part. The first attaching part may achieve high reliability of the semiconductor package in association with the second attaching part. The second attaching part may include a material having a low rigidity. Thus, it is possible to reduce or prevent warpage of the image sensor chip from occurring. Due to the presence of the second attaching part, a plane coverage ratio of the first attaching part relative to the image sensor chip can be reduced. Thus, the warpage of the image sensor chip can be reduced or prevented more effectively.

Abstract translation: 可以提供包括包括环氧基材料的基板，安装在基板上的图像传感器芯片以及设置在基板和图像传感器芯片之间的附接部分的半导体封装。 安装部可以包括第一安装部和围绕第一安装部设置的第二安装部。 第一附接部件可以实现与第二附接部件相关联的半导体封装件的高可靠性。 第二安装部可以包括刚性低的材料。 因此，可以减少或防止图像传感器芯片的翘曲发生。 由于第二安装部的存在，可以减少第一安装部相对于图像传感器芯片的平面覆盖率。 因此，可以更有效地降低或防止图像传感器芯片的翘曲。