公开(公告)号：US11605551B2

公开(公告)日：2023-03-14

申请号：US17408437

申请日：2021-08-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngjae Son ,  Guesuk Lee ,  Taemin Earmme ,  Hyeongyun Lee ,  Seungchul Han

IPC: H01L21/683 ,  H01L21/67

Abstract: Disclosed are chuck assemblies, semiconductor device fabricating apparatuses, and methods of fabricating semiconductor devices. The chuck assembly comprises a chuck base including lower and upper bases, a ceramic plate on the upper base, an edge ring that surrounds the ceramic plate, a ground ring that surrounds an outer sidewall of the edge ring on an edge portion of the lower base, a coupling ring between the ground ring and the upper base and between the edge ring and the edge portion of the lower base, an upper heat sink between the coupling ring and the edge ring, and a sidewall heat sink between the coupling ring and the ground ring and between the coupling ring and the upper base.