PATTERN INSPECTION APPARATUS AND PATTERN INSPECTION METHOD USING THE SAME

    公开(公告)号:US20240192154A1

    公开(公告)日:2024-06-13

    申请号:US18243835

    申请日:2023-09-08

    CPC classification number: G01N23/2251 G01N2223/42 G01N2223/6116

    Abstract: A pattern inspection apparatus includes a sample including a plurality of holes having thicknesses that are different from each other, an electron gun configured to generate an input electron beam and emit the input electron beam onto a wafer and the sample, a stage configured to support the wafer and the sample, a detector configured to generate a scanning electron microscope (SEM) image by detecting emitted electrons from the wafer and the sample, and a processor configured to process the SEM image into a three-dimensional profiling image containing depth information of the wafer and determine whether a condition of the input electron beam has changed based on the processing of the SEM image.

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