公开(公告)号：US20250166407A1

公开(公告)日：2025-05-22

申请号：US18771182

申请日：2024-07-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hojin SEO ,  Hyunggil BAEK

IPC: G06V40/13

Abstract: A fingerprint sensor package includes a substrate including a plurality of first sensing patterns spaced apart from each other in a first direction and extending in a second direction intersecting the first direction, and a plurality of second sensing patterns spaced apart from each other in the second direction and extending in the first direction; a film substrate defining a through-hole region penetrating the film substrate, the through-hole region overlapping a portion of the substrate in a vertical direction; a controller chip in the through-hole region, the controller chip being electrically connected to the substrate; a plurality of first bonding pads on an upper surface of the film substrate; a plurality of second bonding pads on a lower surface of the substrate; and a plurality of bumps electrically connected between the plurality of first bonding pads and the plurality of second bonding pads.