公开(公告)号：US08721126B2

公开(公告)日：2014-05-13

申请号：US13938128

申请日：2013-07-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chul Hee Yoo ,  Ho Sik Ahn

IPC: F21V29/00

CPC classification number: F21V29/70 ,  G02F1/133603 ,  H05K1/0206 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/4069 ,  H05K2201/0209 ,  H05K2201/09072 ,  H05K2201/10106

Abstract: A backlight unit includes a flexible printed circuit board having a least one through hole perforated therein, and an LED package disposed on a top portion of the flexible printed circuit board corresponding to the through hole. The LED package is directly bonded onto a bottom plate by a heat conductive adhesive.

Abstract translation: 背光单元包括柔性印刷电路板，其中具有穿孔的至少一个通孔，以及布置在柔性印刷电路板的与通孔对应的顶部上的LED封装。 LED封装通过导热粘合剂直接粘合到底板上。