公开(公告)号：US20130301276A1

公开(公告)日：2013-11-14

申请号：US13938128

申请日：2013-07-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chul Hee YOO ,  Ho Sik AHN

IPC: F21V29/00

CPC classification number: F21V29/70 ,  G02F1/133603 ,  H05K1/0206 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/4069 ,  H05K2201/0209 ,  H05K2201/09072 ,  H05K2201/10106

Abstract: A backlight unit of the invention is reduced in thickness, weight and manufacturing costs but improved in heat releasing efficiency. In the backlight unit, a flexible printed circuit board has at least one through hole perforated therein. An LED package is disposed on a top portion of the flexible printed circuit board corresponding to the through hole. The backlight unit of the invention employs the flexible printed circuit board in place of a metal printed circuit board as a means to conduct current to the LED package. This produces a slimmer and lighter backlight unit and also saves manufacturing costs. In addition, the LED package is directly bonded onto a bottom plate by a heat conducting adhesive, thereby ensuring heat generated from the LED package to be released more quickly.

Abstract translation: 本发明的背光单元的厚度，重量和制造成本降低，但散热效率提高。 在背光单元中，柔性印刷电路板具有穿孔的至少一个通孔。 LED封装设置在与通孔对应的柔性印刷电路板的顶部上。 本发明的背光单元采用柔性印刷电路板代替金属印刷电路板作为将电流传导到LED封装的手段。 这产生了更薄和更轻的背光单元，并且还节省制造成本。 此外，LED封装通过导热粘合剂直接接合到底板上，从而确保从LED封装产生的热量更快地释放。