公开(公告)号：US11152686B2

公开(公告)日：2021-10-19

申请号：US16107277

申请日：2018-08-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong Ryul Shin ,  Him Chan YuN ,  Yoon Jae Lee ,  Jung Hoon Seo ,  Ui Chul Jeong

IPC: H01Q1/24 ,  H01Q1/22 ,  H01Q5/371 ,  H01Q1/50 ,  H01Q9/04 ,  H05K1/02 ,  H05K1/18

Abstract: An electronic device which includes a housing is provided. The housing includes a first surface, a second surface facing away from the first surface, and a side member surrounding a space between the first surface and the second surface, a display that is exposed through a substantial portion of the first surface of the housing, a first radiator that forms a portion of the side member, a PCB that is positioned within the housing and includes a ground layer, a communication circuit that is positioned on the PCB, and a conductive pattern having a length corresponding to a length of the first radiator.