公开(公告)号：US20230171932A1

公开(公告)日：2023-06-01

申请号：US18160475

申请日：2023-01-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunjoong YOON ,  Heesoon PARK

IPC: H05K9/00 ,  H01Q1/24 ,  H04M1/02 ,  H05K7/20

CPC classification number: H05K9/0081 ,  H01Q1/243 ,  H04M1/0277 ,  H05K7/20963

Abstract: An electronic device includes an electronic component on ae printed circuit board, an electrical shield extended around the electronic component and defining an opening corresponding to the electronic component, a heat diffusion pattern on the electronic component, and a shielding sheet which extends across the opening of the electrical shield and commonly overlaps the electronic component, the electrical shield and the heat diffusion pattern. The shielding sheet includes a first heat diffusion member which is inside the opening of the electrical shield and contacts the heat diffusion pattern, and a second heat diffusion member which is attached to the first heat diffusion member, extends across the opening of the electrical shield and contacts both an upper portion of the electrical shield and the first heat diffusion member.