公开(公告)号：US20250132731A1

公开(公告)日：2025-04-24

申请号：US18891457

申请日：2024-09-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hansik OH ,  Seungwon PARK ,  Sunggi YANG ,  Jooseok LEE

IPC: H03F1/02 ,  H03F1/56 ,  H03F3/24 ,  H03F3/45 ,  H03F3/60

Abstract: In various embodiments, circuitry is provided. The circuitry may comprise: driver amplification circuitry, phase offset circuitry, balun circuitry, carrier amplifier circuitry, and peaking amplifier circuitry. The phase offset circuitry may comprise a first line connected to the driver amplification circuitry and configured to provide a first single-ended signal having a first phase delay. The phase offset circuitry may comprise a second line connected to the driver amplification circuitry and configured to provide a second single-ended signal having a second phase delay different from the first phase delay of the first single-ended signal of the first line. The balun circuitry may comprise first balun circuitry connected between the first line and the carrier amplifier circuitry, and second balun circuitry connected between the second line and the peaking amplifier circuitry.