公开(公告)号：US10372159B2

公开(公告)日：2019-08-06

申请号：US15273018

申请日：2016-09-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hae-Soo Kim ,  Dong-Yun Lee ,  Woo-Jung Shim

IPC: G06F1/16

Abstract: An electronic device is provided, which uses magnetic force to couple to an external device. The electronic device includes a housing, a magnet positioned within the housing, and an elastic body connected to the magnet. At least a portion of the elastic body changes a shape or a position thereof, in response to a change of a magnetic force of the magnet.

公开(公告)号：US09639127B2

公开(公告)日：2017-05-02

申请号：US14667035

申请日：2015-03-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hae-Soo Kim

IPC: G06F1/20 ,  H05K7/20 ,  F28F21/08 ,  F28D15/04 ,  F28D15/02 ,  F28F21/02

CPC classification number: G06F1/203 ,  F28D15/0233 ,  F28D15/046 ,  F28F21/02 ,  F28F21/081 ,  F28F21/083 ,  F28F21/084 ,  F28F21/085 ,  F28F21/089 ,  F28F2265/10 ,  H01L23/427 ,  H05K7/20336

Abstract: A heat dissipating apparatus and an electronic device having the same are provided. The electronic device includes a body, an internal circuit board provided in the body and including at least one heat generating element, and a heat diffusion type heat dissipating module provided in the body and stacked on a surface of the internal circuit board, so as to diffuse heat generated by the heat generating element toward a low temperature region having a temperature lower than a temperature of the at least one heat generating unit. The heat diffusion type heat dissipating module has a sheet shape which extends from the heat generating element toward a circumference surface of an inside of the body so that the heat is transferred from the heat generating element to the low temperature region.

公开(公告)号：US09710024B2

公开(公告)日：2017-07-18

申请号：US15044615

申请日：2016-02-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong-sung Kim ,  Hae-Soo Kim ,  Cha-Hoon Park ,  Kang-Seok Cho ,  Sung-Geun Joo ,  Sung-Hun Kim ,  Kwang-Yong Lee ,  Sung-Yun Jin

IPC: G06F1/16 ,  G06F1/18

CPC classification number: G06F1/1698 ,  G06F1/181 ,  G06F1/183 ,  G06F2200/1635

Abstract: An electronic device is provided. The electronic device includes a main unit including a first top surface, a first bottom surface opposite to the first top surface, and a first side surface configured to connect the first top surface and the first bottom surface, and at least one module unit including a second top surface, a second bottom surface opposite to the second top surface, and a second side surface configured to connect the second top surface and the second bottom surface. The module unit may be configured to couple to and uncouple from the main unit or another module unit in a state where one of the second top surface, the second bottom surface, and the second side surface faces one of the first top surface, the first bottom surface, and the first side surface. When the module unit is coupled to the main unit, the module unit may be electrically connected with the main unit.