公开(公告)号：US20240105679A1

公开(公告)日：2024-03-28

申请号：US18135035

申请日：2023-04-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： YOUNG KUN JEE ,  SANGHOON LEE ,  UN-BYOUNG KANG ,  SANG CHEON PARK ,  JUMYONG PARK ,  HYUNCHUL JUNG

IPC: H01L25/065 ,  H01L21/768 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48

CPC classification number: H01L25/0657 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/03 ,  H01L24/08 ,  H01L2224/03 ,  H01L2224/08146 ,  H01L2225/06541

Abstract: Disclosed are semiconductor packages and their fabrication methods. The semiconductor package comprises providing a semiconductor substrate, forming a semiconductor element on an active surface of the semiconductor substrate, forming in the semiconductor substrate through vias that extend from the active surface into the semiconductor substrate, forming a first pad layer on the active surface of the semiconductor substrate, performing a first planarization process on the first pad layer, performing on an inactive surface of the semiconductor substrate a thinning process to expose the through vias, forming a second pad layer on the inactive surface of the semiconductor substrate, performing a second planarization process on the second pad layer, and after the second planarization process, performing a third planarization process on the first pad layer.