公开(公告)号：US20220238571A1

公开(公告)日：2022-07-28

申请号：US17522142

申请日：2021-11-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang-Su PARK ,  Kwansik Kim ,  Changhwa Kim ,  Taemin Kim ,  Gyuhyun Lim

IPC: H01L27/146

Abstract: An image sensor includes a substrate including a first surface and a second surface which is opposite to the first portion, and a pixel isolation portion provided in the substrate and configured to isolate unit pixels from each other. The pixel isolation portion includes a first filling insulation pattern extending from the first surface toward the second surface and having an air gap region, the first filling insulation pattern including a first sidewall and a second sidewall which is opposite to the first sidewall, a conductive structure including a first portion on the first sidewall, a second portion on the second sidewall, and a connection portion connecting the first portion and the second portion, and an insulating liner provided between the first portion and the substrate and between the second portion and the substrate.

公开(公告)号：US12191335B2

公开(公告)日：2025-01-07

申请号：US17522142

申请日：2021-11-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang-Su Park ,  Kwansik Kim ,  Changhwa Kim ,  Taemin Kim ,  Gyuhyun Lim

IPC: H01L27/146

Abstract: An image sensor includes a substrate including a first surface and a second surface which is opposite to the first portion, and a pixel isolation portion provided in the substrate and configured to isolate unit pixels from each other. The pixel isolation portion includes a first filling insulation pattern extending from the first surface toward the second surface and having an air gap region, the first filling insulation pattern including a first sidewall and a second sidewall which is opposite to the first sidewall, a conductive structure including a first portion on the first sidewall, a second portion on the second sidewall, and a connection portion connecting the first portion and the second portion, and an insulating liner provided between the first portion and the substrate and between the second portion and the substrate.

公开(公告)号：US20220375982A1

公开(公告)日：2022-11-24

申请号：US17564308

申请日：2021-12-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min-Jun Choi ,  Wonoh Ryu ,  Gyuhyun Lim ,  Myungjo Jung

IPC: H01L27/146

Abstract: Disclosed are image sensors and methods of fabricating the same. The image sensor comprises a substrate including a plurality of pixels, a photoelectric conversion region in the substrate at each of the pixels, a gate electrode on the substrate at each of the pixels, an interlayer dielectric layer on the substrate and the gate electrode, and a contact penetrating the interlayer dielectric layer and on the gate electrode. The contact includes a lower part on the gate electrode and an upper part on the lower part and connected to a wiring line on the interlayer dielectric layer. A planar shape of the lower part of the contact is larger than that of the upper part of the contact.