公开(公告)号：US20250163569A1

公开(公告)日：2025-05-22

申请号：US18753418

申请日：2024-06-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soyoung LEE ,  Jeong-Do OH ,  Eun Hyea KO ,  Ee-Seul SHIN ,  Kwan-Hyun PARK ,  Kang-Min LEE ,  Younjoung CHO ,  Hoon HAN ,  Byungkeun HWANG ,  Sunhye HWANG

IPC: C23C16/04 ,  B05D1/00 ,  C23C16/02 ,  C23C16/06

Abstract: An area-selective film forming method may include preparing a substrate having at least two areas made of different materials, forming a polyurea film on the at least two areas of the substrate, annealing the polyurea film and selectively removing the polyurea film on at least one area among the at least two areas, and forming a target film on the one area or a remaining area among the at least two areas. The one area may be an area from which the polyurea film is removed. The remaining area may be an area in which the polyurea film is not removed during the annealing the polyurea film and the selectively removing the polyurea film.