公开(公告)号：US20250107098A1

公开(公告)日：2025-03-27

申请号：US18807157

申请日：2024-08-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kohji Kanamori ,  Jae-Bok Baek ,  Donghyuck Jang ,  Jeehoon Han

IPC: H10B43/40 ,  H10B41/27 ,  H10B41/41 ,  H10B43/27

Abstract: Disclosed are semiconductor devices and electronic systems. The semiconductor device comprises a semiconductor substrate including first and second cell array regions and a connection region including a lower pad region and an upper pad region, a peripheral circuit structure including peripheral circuits on the semiconductor substrate, and a cell array structure on the peripheral circuit structure and including a first stack structure including first conductive patterns stacked on the peripheral circuit structure and a second stack structure including second conductive patterns stacked on the first stack structure. The first stack structure includes a connection portion that has a uniform thickness on the upper pad region, and first and second stepwise structures that are asymmetric with each other on the lower pad region. The second stack structure includes third and fourth stepwise structures that are symmetric with each other on the connection portion of the first stack structure.