公开(公告)号：US20170102427A1

公开(公告)日：2017-04-13

申请号：US15285849

申请日：2016-10-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong-young LEE ,  Byoung-jun MIN ,  Jong-cheol LEE

IPC: G01R31/26 ,  G01R31/28

CPC classification number: G01R31/2601 ,  G01R31/2875 ,  G01R31/2893 ,  G01R31/31718

Abstract: A semiconductor test apparatus includes: a tray housing unit configured to house a customer tray loading untested semiconductor chips, secondary semiconductor chips, and non-defective semiconductor chips; a loader configured to locate the untested semiconductor chips supplied from the tray housing unit on a loading set plate and load the untested semiconductor chips onto a test tray; a tester configured to test semiconductor chips loaded on the test tray; an unloader configured to unload semiconductor chips loaded on the test tray, classify the tested semiconductor chips, and locate the classified semiconductor chips on an unloading set plate; and a retest controller configured to transfer the secondary defective semiconductor chips and the non-defective semiconductor chips to the tray housing unit and transfer the first defective semiconductor chips to the loading set plate.