公开(公告)号：US20210291493A1

公开(公告)日：2021-09-23

申请号：US16324936

申请日：2017-06-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Gyun KIM ,  Jee Young OH ,  Da Um HWANG

IPC: B32B17/06 ,  H05K5/00 ,  B32B3/02

Abstract: Various embodiments described herein disclose a protective cover of an electronic device, a protective cover package including the protective cover, and an electronic device to which the protective cover is applied. The protective cover includes a first protective layer including a flat region and a curved region and having a specified transparency, the curved region being disposed at an edge of the flat region and having a specified curvature, a second protective layer disposed below the first protective layer, the second protective layer being thicker than the first protective layer by a specified thickness or more, a bonding layer for bonding the first protective layer and the second protective layer, and an adhesive layer disposed below the second protective layer, wherein the first protective layer is thicker than the second protective layer. Various embodiments are possible.