公开(公告)号：US20200098708A1

公开(公告)日：2020-03-26

申请号：US16696917

申请日：2019-11-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ki Cheol BAE ,  Chul Woo PARK ,  Kwang Sub LEE ,  Sang Gyun LEE ,  Se Young JANG ,  Chi Hyun CHO

IPC: H01L23/64 ,  H01L49/02 ,  H01L25/18 ,  H01L25/10 ,  H01L25/16

Abstract: A semiconductor assembly with a package on package (POP) structure includes a first semiconductor package having a first lower substrate, a first upper substrate facing the first lower substrate, and a first semiconductor chip mounted on an area of the first lower substrate. The POP structure further includes a second semiconductor package having a second lower substrate stacked on the first semiconductor package and spaced apart from the first semiconductor package, and a second semiconductor chip mounted in an area of the second lower substrate. At least one passive element is disposed in one of the first upper substrate and the second lower substrate and electrically connected to the second semiconductor chip.

公开(公告)号：US20170256968A1

公开(公告)日：2017-09-07

申请号：US15446694

申请日：2017-03-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Geun YOON ,  Chul Woo PARK ,  Min Jeong LEE ,  Ku Chul JUNG

IPC: H02J7/00 ,  H01R24/60

Abstract: An electronic device is provided which includes a connector connected with an external electronic device, a plug connected with an external power source, a power supply circuit that supplies power to the external electronic device through the connector, a first charging module configured to receive first protocol-related charging request information and change a charging voltage and a charging current of the power supply circuit based on the charging request information, a second charging module configured to receive second protocol-related charging request information from the external electronic device, and a processor configured to convert the second protocol-related charging request information to the first protocol-related charging request information and transmit the converted first protocol-related charging request information to the first charging module.

公开(公告)号：US20140310481A1

公开(公告)日：2014-10-16

申请号：US14248779

申请日：2014-04-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hoi Ju CHUNG ,  Su A KIM ,  Chul Woo PARK ,  Hak Soo YU ,  Jae Youn YOUN ,  Jung Bae LEE ,  Hyo Jin CHOI

IPC: G06F13/16

CPC classification number: G06F13/161 ,  G06F13/1657 ,  G06F13/1694

Abstract: A memory system includes a memory controller to control a first memory device and a second memory device. The first and second memory devices are different in terms of at least one of physical distance from the memory controller, a manner of connection to the memory controller, error correction capability, or memory supply voltage. The first and second memory devices also have different latencies.

Abstract translation: 存储器系统包括用于控制第一存储器件和第二存储器件的存储器控​​制器。 第一和第二存储器件在与存储器控制器的物理距离，存储器控制器的连接方式，纠错能力或存储器电源电压中的至少一个方面是不同的。 第一和第二存储器件也具有不同的延迟。