公开(公告)号：US11343914B2

公开(公告)日：2022-05-24

申请号：US16281702

申请日：2019-02-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wangik Son ,  Minho Kim ,  Sunghyun Kim ,  Eungwon Kim ,  Chanbeom Jeong

IPC: H05K1/14 ,  H01R4/04 ,  H01R12/51 ,  H05K1/02 ,  H05K9/00 ,  H05K7/14

Abstract: An electronic device is provided. The electronic device includes a conductive support member, a first circuit board connected to the conductive support member by a first capacitor, a second circuit board connected to the conductive support member by a second capacitor, a first conductive connection member electrically connecting the first circuit board and the second circuit board, and a first ground structure, at least a portion of the first ground structure being interposed between the first conductive connection member and the conductive support member. The ground structure includes a non-conductive layer physically contacting the conductive support member, and a conductive layer electrically connected to the first conductive connection member to form a capacitive coupling with the conductive support member.