公开(公告)号：US20170011976A1

公开(公告)日：2017-01-12

申请号：US15175017

申请日：2016-06-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myeong-soon PARK ,  Hyun-soo CHUNG ,  Chan-ho LEE

IPC: H01L21/66 ,  H01L27/108

Abstract: A semiconductor chip is disclosed that includes a chip pad disposed in a first region of a chip body, a redistribution wiring test pad disposed in the first region of the chip body spaced apart from the chip pad and connected to the chip pad through a redistribution wiring structure, and a redistribution wiring connection pad disposed in the first region of the chip body or a second region of the chip body and connected to the chip pad through the redistribution wiring structure.

Abstract translation: 公开了一种半导体芯片，其包括设置在芯片体的第一区域中的芯片焊盘，布置在芯片体的与芯片焊盘间隔开的第一区域中的再分配布线测试焊盘，并通过再分配布线连接到芯片焊盘 结构，以及设置在芯片体的第一区域或芯片体的第二区域中并且通过再分配布线结构连接到芯片焊盘的再分配布线连接焊盘。