公开(公告)号：US20180337690A1

公开(公告)日：2018-11-22

申请号：US15979904

申请日：2018-05-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chan-Sik PARK ,  Chan-Yul PARK ,  Yong-Chul KIM

IPC: H03M7/40 ,  H03M7/42

CPC classification number: H03M7/4031 ,  H03M7/40 ,  H03M7/42 ,  H03M7/6035

Abstract: According to an embodiment of the present disclosure, an electronic device may comprise a memory and a processor configured to produce compressed data by compressing data including a first block and a second block stored in the memory, wherein the processor may be configured to include a first replacement data table corresponding to first sub-data in the compressed data, the first sub-data included in the first block, and the first replacement data table produced based on, at least, rankings of first frequencies for the first sub-data, and include information for reference to the first replacement data table, corresponding to the second block, when second sub-data included in the second block and rankings of second frequencies for the second sub-data meet a designated condition with respect to the first sub-data included in the first block and the rankings of the first frequencies. Other embodiments are also possible.