公开(公告)号：US20240274762A1

公开(公告)日：2024-08-15

申请号：US18433643

申请日：2024-02-06

Applicant: Samsung Electronics Co., Ltd

Inventor： Jihoon YUN ,  Daesup Kim ,  Sungmok Hong ,  Jungsung Kim ,  Mihwa Yu

IPC: H01L33/54 ,  H01L33/48

CPC classification number: H01L33/54 ,  H01L33/483

Abstract: A light emitting diode (LED) package includes a body including a body molding layer having an opening, and a metal plate surrounded by the body molding layer, an upper surface of the metal plate being exposed through the opening of the body molding layer; an LED chip on the upper surface of the metal plate exposed through the opening of the body molding layer; and a lens molding layer, the lens molding layer including a lens portion on the LED chip and a peripheral portion on the body molding layer, wherein the body molding layer includes a plurality of recess regions adjacent to the opening of the body molding layer and extending outwardly in a radial direction of the opening of the body molding layer, and the peripheral portion fills the plurality of recess regions.