DEPOSITION APPARATUS AND DEPOSITION METHOD
    1.
    发明申请
    DEPOSITION APPARATUS AND DEPOSITION METHOD 审中-公开
    沉积装置和沉积方法

    公开(公告)号:US20150184289A1

    公开(公告)日:2015-07-02

    申请号:US14468042

    申请日:2014-08-25

    CPC classification number: C23C16/52 C23C16/45536 C23C16/45551

    Abstract: An apparatus may be used for forming a material layer on a substrate. The apparatus may include a reactor that includes a supply unit set configured to supply a material to the substrate. The apparatus may further include a control mechanism configured to control whether the material is provided to the supply unit set according to a position of the substrate with respect to the reactor.

    Abstract translation: 可以使用一种装置在衬底上形成材料层。 该装置可以包括反应器,其包括被配置为将材料供应到基板的供应单元组。 该装置还可以包括控制机构,该控制机构被配置为根据基板相对于反应器的位置来控制材料是否被提供给供应单元组。

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