公开(公告)号：US10078976B2

公开(公告)日：2018-09-18

申请号：US15398162

申请日：2017-01-04

Applicant: Samsung Display Co., Ltd.

Inventor： Wi Jin Nam ,  Hyeon Jin Kim ,  Soon Nyung Park

IPC: H01L27/12 ,  G09G3/00 ,  H01L27/32 ,  H01L21/66

CPC classification number: G09G3/006 ,  G09G2300/0413 ,  G09G2300/0426 ,  G09G2330/12 ,  H01L22/32 ,  H01L27/124 ,  H01L27/3223

Abstract: An exemplary embodiment of the present disclosure provides a display device including: a substrate including a display area and a non-display area; a COF package overlapped with the non-display area of the substrate; a printed circuit board (PCB) overlapped with the COF package; a plurality of pixels disposed on the display area of the substrate; a plurality of data lines connected to the plurality of pixels; a first crack sensing line disposed on the non-display area of the substrate; a second crack sensing line that extends to be parallel to the first crack sensing line on the non-display area of the substrate and is connected to the first data line of the plurality of data lines; a first dummy wire that is disposed on the COF package and is overlapped with the first crack sensing line and the second crack sensing line; a first anisotropic conductive film disposed between the substrate and the COF package; a first test pattern and a second test pattern disposed on the PCB; a third test pattern that is disposed on the COF package and is overlapped with the first test pattern and the second test pattern; and a second anisotropic conductive film disposed between the COF package and the PCB.

公开(公告)号：US20170270842A1

公开(公告)日：2017-09-21

申请号：US15398162

申请日：2017-01-04

Applicant: Samsung Display Co., Ltd.

Inventor： Wi Jin Nam ,  Hyeon Jin Kim ,  Soon Nyung Park

IPC: G09G3/00 ,  H01L27/12 ,  H01L21/66

CPC classification number: G09G3/006 ,  G09G2300/0413 ,  G09G2330/12 ,  H01L22/32 ,  H01L27/124 ,  H01L27/3223

Abstract: An exemplary embodiment of the present disclosure provides a display device including: a substrate including a display area and a non-display area; a COF package overlapped with the non-display area of the substrate; a printed circuit board (PCB) overlapped with the COF package; a plurality of pixels disposed on the display area of the substrate; a plurality of data lines connected to the plurality of pixels; a first crack sensing line disposed on the non-display area of the substrate; a second crack sensing line that extends to be parallel to the first crack sensing line on the non-display area of the substrate and is connected to the first data line of the plurality of data lines; a first dummy wire that is disposed on the COF package and is overlapped with the first crack sensing line and the second crack sensing line; a first anisotropic conductive film disposed between the substrate and the COF package; a first test pattern and a second test pattern disposed on the PCB; a third test pattern that is disposed on the COF package and is overlapped with the first test pattern and the second test pattern; and a second anisotropic conductive film disposed between the COF package and the PCB.