公开(公告)号：US20160155719A1

公开(公告)日：2016-06-02

申请号：US14706752

申请日：2015-05-07

Applicant: Samsung Display Co., Ltd.

Inventor： Seong Beom JEONG ,  Min Su Kim

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L24/75 ,  H01L2224/83048 ,  H01L2224/83091 ,  H01L2224/83121 ,  H01L2224/83851

Abstract: The chip bonding apparatus used in a chip bonding method includes a heating unit for heating an anisotropic conductive film at a first temperature; an attachment unit for attaching an integrated circuit chip to the anisotropic conductive film; a stage on which a substrate is seated; a chip transport unit for moving and aligning the integrated circuit chip that is attached to the anisotropic conductive film on the substrate; and a bonding head arranged above the stage to bond the integrated circuit chip that is attached to the anisotropic conductive film onto the substrate through thermo-compression of the integrated circuit chip onto the substrate at a second temperature that is lower than the first temperature.

Abstract translation: 用于芯片接合方法的芯片接合装置包括：加热单元，用于在第一温度下加热各向异性导电膜; 用于将集成电路芯片附接到各向异性导电膜的附接单元; 衬底就座的阶段; 芯片传送单元，用于移动和对准附着到基板上的各向异性导电膜的集成电路芯片; 以及结合头，其布置在所述平台上方，以在低于所述第一温度的第二温度下将所述集成电路芯片通过所述集成电路芯片的热压缩而将附着于所述各向异性导电膜的所述集成电路芯片接合到所述基板上。