公开(公告)号：US11246219B2

公开(公告)日：2022-02-08

申请号：US16918946

申请日：2020-07-01

申请人： Samsung Display Co., Ltd.

发明人： John Park ,  Seung-Woo Kang ,  Soon-Sung Park ,  Jun Ho Park ,  Yong Uk Song ,  Su Chang Ryu ,  Jung Soo Youn

IPC分类号： H05K1/00 ,  H05K1/18 ,  H05K1/11 ,  H05K3/32 ,  G06F3/041

摘要： A flexible printed circuit board including: a base film; an electrode pad disposed on one side of the base film; a circuit pattern connected with the electrode pad; a coverlay that overlaps at least a part of the circuit pattern; and a cover resin that overlaps the circuit pattern and at least a part of the coverlay. The coverlay includes a body portion and a protrusion protruded from the body portion.