公开(公告)号：US11493679B2

公开(公告)日：2022-11-08

申请号：US17109117

申请日：2020-12-01

Applicant: Samsung Display Co., Ltd.

Inventor： Hyun Hyang Kim ,  Hyun Jeong Kim ,  Ji Eun Nam ,  Young Keun Lee ,  Hyeon Mi Lee

IPC: F21V8/00

Abstract: A backlight unit for a display device includes: a light guide including a light incident surface; a substrate facing the light incident surface; a plurality of light sources on one surface of the substrate facing the light incident surface; and a first member disposed between the substrate and the light incident surface to space the light sources apart from the light guide. The first member includes: a support on one surface of the substrate that do not include the light source, the support having a first surface facing the light incident surface and a second surface facing the light sources; and a first layer disposed on the first surface and the second surface of the support to improve luminance uniformity across the light incident surface.

公开(公告)号：US09971197B2

公开(公告)日：2018-05-15

申请号：US14283917

申请日：2014-05-21

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Si Joon Song ,  Hyuk Hwan Kim ,  Hyun Jeong Kim ,  Seok Hyun Nam ,  Young Keun Lee

IPC: G09F13/04 ,  G09F13/08 ,  G02F1/1335 ,  F21V5/04 ,  F21V7/00 ,  F21V7/04 ,  F21V13/04 ,  H05K1/02 ,  G02B19/00 ,  F21Y115/10 ,  F21V23/00 ,  F21V23/04

CPC classification number: G02F1/133611 ,  F21V5/046 ,  F21V7/0066 ,  F21V7/04 ,  F21V13/04 ,  F21V23/004 ,  F21Y2115/10 ,  G02B19/0028 ,  G02B19/0061 ,  G02B19/0071 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133606 ,  G02F2001/133607 ,  H05K1/0274 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/2054

Abstract: A light source module includes a printed circuit board including a wiring layer, an insulating coating layer disposed on the wiring layer, and a reflection adjustment pattern disposed on the insulating coating layer and having reflection characteristics which are different from reflection characteristics of the insulating coating layer, a light emitting chip mounted on the printed circuit board, and an optical lens arranged on an upper portion of the light emitting chip and fixed to the printed circuit board.