DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20230145495A1

    公开(公告)日:2023-05-11

    申请号:US17876853

    申请日:2022-07-29

    CPC classification number: H01L51/0097 H01L51/56 H01L2251/5338

    Abstract: A display device includes a display panel including a first area including a pixel and at which the display panel is foldable, a second area on which a driver connected to the pixel is disposed, and a bending area between the first area and the second area and at which the display panel is bendable, a functional layer on the first area, and a protective layer on the bending area, a groove is defined in one surface of the protective layer, which does not face the display panel, and the groove is adjacent to the first area.

    BONDING DEVICE
    3.
    发明申请

    公开(公告)号:US20210305183A1

    公开(公告)日:2021-09-30

    申请号:US17116902

    申请日:2020-12-09

    Abstract: A bonding device includes a stage supporting a display panel including a first area through which a pad is exposed, a sensor disposed on the stage and facing the first area, and a handler disposing a circuit board on the first area. The handler includes a body supporting the circuit board and a rod connected to the body and selectively in contact with a second area of the circuit board overlapping the first area.

    ALIGNMENT PAD OF DISPLAY PANEL AND DISPLAY DEVICE HAVING THE SAME

    公开(公告)号:US20230225162A1

    公开(公告)日:2023-07-13

    申请号:US18075735

    申请日:2022-12-06

    CPC classification number: H01L27/3276

    Abstract: A display device includes a display area and a non-display area including a first driving pad portion at which a display panel is connected to an integrated circuit chip by a solder bump having a width. The first driving pad portion includes a first pad through which an electrical signal transmits between the first driving pad portion and the integrated circuit chip, and a second pad by which alignment between the first driving pad portion and the integrated circuit chip is determined. The second pad of the first driving pad portion includes a (2-1)-th pad having a width which is the same as the width of the solder bump and a (2-2)-th pad having a width which is larger than the width of the (2-1)-th pad.

    DISPLAY DEVICE
    5.
    发明公开
    DISPLAY DEVICE 审中-公开

    公开(公告)号:US20230223351A1

    公开(公告)日:2023-07-13

    申请号:US18082538

    申请日:2022-12-15

    CPC classification number: H01L23/544 H01L2223/54426

    Abstract: A display device includes a display panel including a non-display area in which a panel pad is disposed, and a pad portion which contacts the non-display area of the display panel, where the pad portion includes an alignment mark overlapping the panel pad, the panel pad includes a first vertical portion and a second vertical portion spaced apart from each other in a first direction, a first horizontal portion connected to the first vertical portion, and a second horizontal portion connected to the second vertical portion, and the first horizontal portion and the second horizontal portion are spaced apart from each other in a second direction crossing the first direction.

    BONDING APPARATUS AND METHOD OF FABRICATING DISPLAY DEVICE USING THE SAME

    公开(公告)号:US20210305201A1

    公开(公告)日:2021-09-30

    申请号:US17123836

    申请日:2020-12-16

    Abstract: A method of fabricating a display device may include disposing a display panel on a stage to be parallel to an XZ-plane defined by a horizontal X-axis and a vertical Z-axis, measuring a height of a first side surface of the display panel in a direction of the Z-axis, rotating the stage such that the first side surface is parallel to a reference horizontal line in case that a result of the measured height indicates that the first side surface includes an inclined surface, moving the display panel in a direction of the Z-axis such that a first pad disposed on the first side surface overlaps the reference horizontal line, and bonding a second pad of a printed circuit board with the first pad.

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