APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING SUBSTRATE USING THE SAME

    公开(公告)号:US20240218513A1

    公开(公告)日:2024-07-04

    申请号:US18479214

    申请日:2023-10-02

    Abstract: An apparatus for treating a substrate includes a first gas pipe extending in a first direction and including a first injection part and a first exhaust part, a second gas pipe extending in the first direction, spaced apart from the first gas pipe in a second direction intersecting the first direction, and including a second injection part and a second exhaust part, multiple first gas connection pipes extending in the second direction, connected to the first gas pipe, and spaced apart from each other in the first direction, multiple second gas connection pipes extending in the second direction, connected to the second gas pipe, and spaced apart from each other in the first direction, and a gas supply adjacent to the plurality of first gas connection pipes and the plurality of second gas connection pipes.

Patent Agency Ranking