公开(公告)号：US11980073B2

公开(公告)日：2024-05-07

申请号：US17520893

申请日：2021-11-08

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jin-Suk Lee ,  Seong Ryong Lee

IPC: H10K59/131 ,  H01L27/12 ,  H10K59/12 ,  H10K77/10 ,  H10K102/00

CPC classification number: H10K59/131 ,  H01L27/1218 ,  H01L27/1244 ,  H01L27/124 ,  H01L27/1288 ,  H10K59/1201 ,  H10K77/111 ,  H10K2102/311

Abstract: A display device includes a substrate including a first area, a second area, and a bending area. A plurality of first wires are positioned in the first area. A plurality of second wires are positioned in the second area. An insulating layer is positioned in the bending area. A plurality of connecting wires are disposed on the insulating layer. Each of the connecting wires is connected with at least one of the first wires and at least one of the second wires. Each of the connecting wires includes a first portion and a second portion alternatingly arranged along an extending direction of the connecting wires. A width of the first portion is wider than a width of the second portion in a direction perpendicular to the extending direction each of the connecting wires.

公开(公告)号：US11171197B2

公开(公告)日：2021-11-09

申请号：US16701237

申请日：2019-12-03

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jin-Suk Lee ,  Seong Ryong Lee

IPC: H01L27/32 ,  H01L27/12 ,  H01L51/00

Abstract: A display device includes a substrate including a first area, a second area, and a bending area. A plurality of first wires are positioned in the first area. A plurality of second wires are positioned in the second area. An insulating layer is positioned in the bending area. A plurality of connecting wires are disposed on the insulating layer. Each of the connecting wires is connected with at least one of the first wires and at least one of the second wires. Each of the connecting wires includes a first portion and a second portion alternatingly arranged along an extending direction of the connecting wires. A width of the first portion is wider than a width of the second portion in a direction perpendicular to the extending direction each of the connecting wires.

公开(公告)号：US11825673B2

公开(公告)日：2023-11-21

申请号：US17146845

申请日：2021-01-12

Applicant: Samsung Display Co., Ltd.

Inventor： Jin-Suk Seo ,  Eung Taek Kim ,  Tae Sik Kim ,  Hee Yeon Kim ,  Jong Hyun Yun ,  Na Lae Lee ,  Jin-Suk Lee ,  Joo Hyeon Jo

IPC: H10K50/13 ,  H10K85/60

CPC classification number: H10K50/13 ,  H10K85/621

Abstract: A display device includes: a substrate; a transistor positioned on the substrate; and a light-emitting device electrically connected to the transistor, wherein the substrate includes a first layer, a second layer positioned between the first layer and the transistor, and a third layer positioned between the second layer and the transistor, the first layer and the third layer include organic materials, and the organic material included by the first layer and the organic material included by the third layer have different half-lives for a corona discharge.

公开(公告)号：US09332641B2

公开(公告)日：2016-05-03

申请号：US14024021

申请日：2013-09-11

Applicant: Samsung Display Co., Ltd.

Inventor： Jin-Suk Lee

IPC: H05K1/11 ,  H05K1/02 ,  H01R12/52 ,  H05K3/36 ,  H05K3/32

CPC classification number: H05K1/117 ,  H01R12/52 ,  H05K1/0248 ,  H05K1/118 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09709 ,  H05K2201/09909

Abstract: A connection structure of a circuit board is disclosed. In one aspect, the connection structure includes a first circuit board, a second circuit board and an adhesive member. A first connection pad and a second connection pad are disposed on the first circuit board. The second circuit board has a first surface facing the first circuit board. A plurality of third connection pads and fourth connection pads are disposed on the first surface of the second circuit board in a staggered pattern. The adhesive member is disposed between the first and second circuit boards. At least one of the third and fourth connection pads is electrically connected to a wire which is disposed on a second surface of the second circuit board opposite to the first surface of the second circuit board.

Abstract translation: 公开了一种电路板的连接结构。 一方面，连接结构包括第一电路板，第二电路板和粘合构件。 第一连接焊盘和第二连接焊盘设置在第一电路板上。 第二电路板具有面向第一电路板的第一表面。 多个第三连接焊盘和第四连接焊盘以交错图案设置在第二电路板的第一表面上。 粘合部件设置在第一和第二电路板之间。 第三和第四连接焊盘中的至少一个电连接到布置在与第二电路板的第一表面相对的第二电路板的第二表面上的导线。

公开(公告)号：US12261176B2

公开(公告)日：2025-03-25

申请号：US17541196

申请日：2021-12-02

Applicant: Samsung Display Co., LTD.

Inventor： Kohei Ebisuno ,  Jin-Suk Lee ,  Jong Min Lee ,  Jun Young Kim ,  Yong Ho Yang

IPC: H01L27/12 ,  G02F1/1345 ,  G02F1/1362 ,  H10K59/131

Abstract: A display device includes: a substrate including a display area and a non-display area; a transistor and a light emitting element, which are disposed on the display area; a pad portion disposed in the non-display area, where the pad portion includes a first metal pattern; and a printed circuit board or a data driver, which is connected with the pad portion. The transistor includes a semiconductor layer disposed on the substrate and a source electrode or a drain electrode which is electrically connected with the semiconductor layer. The source electrode or the drain electrode includes a first layer including a first metal, a second layer including a second metal, and a third layer including the first metal, where the first metal pattern includes the first metal, and is connected with the printed circuit board or the data driver.

公开(公告)号：US20140127916A1

公开(公告)日：2014-05-08

申请号：US14024021

申请日：2013-09-11

Applicant: Samsung Display Co., Ltd.

Inventor： Jin-Suk Lee

IPC: H01R12/52

CPC classification number: H05K1/117 ,  H01R12/52 ,  H05K1/0248 ,  H05K1/118 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09709 ,  H05K2201/09909

Abstract: A connection structure of a circuit board is disclosed. In one aspect, the connection structure includes a first circuit board, a second circuit board and an adhesive member. A first connection pad and a second connection pad are disposed on the first circuit board. The second circuit board has a first surface facing the first circuit board. A plurality of third connection pads and fourth connection pads are disposed on the first surface of the second circuit board in a staggered pattern. The adhesive member is disposed between the first and second circuit boards. At least one of the third and fourth connection pads is electrically connected to a wire which is disposed on a second surface of the second circuit board opposite to the first surface of the second circuit board.

Abstract translation: 公开了一种电路板的连接结构。 一方面，连接结构包括第一电路板，第二电路板和粘合构件。 第一连接焊盘和第二连接焊盘设置在第一电路板上。 第二电路板具有面向第一电路板的第一表面。 多个第三连接焊盘和第四连接焊盘以交错图案设置在第二电路板的第一表面上。 粘合部件设置在第一和第二电路板之间。 第三和第四连接焊盘中的至少一个电连接到布置在与第二电路板的第一表面相对的第二电路板的第二表面上的导线。