公开(公告)号：US20240107832A1

公开(公告)日：2024-03-28

申请号：US18212094

申请日：2023-06-20

Applicant: Samsung Display Co., LTD.

Inventor： Youngmin CHO ,  Hongam KIM

IPC: H10K59/131 ,  H01L23/00

CPC classification number: H10K59/131 ,  H01L24/05 ,  H01L24/06 ,  H01L24/32 ,  H10K59/35

Abstract: A display device includes a display panel, in which a display region and a non-display region are defined, where the display panel includes a base layer including a front surface and a rear surface opposing the front surface, a circuit layer including pixel circuits disposed on the front surface, where each pixel circuit includes semiconductor patterns and conductive patterns, a light emitting device layer including light emitting devices connected to relevant pixel circuits of the pixel circuits, and display pads connected to the relevant pixel circuits and exposed to the rear surface overlapping the display region, and a circuit board disposed on the rear surface overlapping the display region and including substrate pads connected to the display pads. A first display pad and a second display pad, which are adjacent to each other, of the display pads overlap pixels with a substantially same overlapping region as each other.

公开(公告)号：US20220137682A1

公开(公告)日：2022-05-05

申请号：US17352991

申请日：2021-06-21

Applicant: Samsung Display Co., LTD.

Inventor： Hongam KIM ,  Youngmin CHO

IPC: G06F1/18 ,  G09F9/30

Abstract: A display device includes a substrate including a display area and a pad area, a display structure disposed in the display area on the substrate, and a driving integrated circuit disposed in the pad area on the substrate and including a circuit part including an input area, a first output area adjacent to the display area, and a second output area between the input area and the first output area, upper output bumps disposed in the first output area on a bottom surface of the circuit part, and lower output bumps disposed in the second output area on the bottom surface of the circuit part. First output pads are disposed between the substrate and the upper output bumps, and have a first height. Second output pads are disposed between the substrate and the lower output bumps, and have a second height smaller than the first height.