DEPOSITION MASK
    1.
    发明公开
    DEPOSITION MASK 审中-公开

    公开(公告)号:US20240175115A1

    公开(公告)日:2024-05-30

    申请号:US18466941

    申请日:2023-09-14

    CPC classification number: C23C14/042 C23C14/24 H10K59/10

    Abstract: A deposition mask for forming a pattern on a substrate to be deposited, includes a first portion having an upper surface, a second portion having an upper surface half-etched to a first depth from the upper surface of the first portion, and a third portion having an upper surface half-etched to a second depth from the upper surface of the second portion. The third portion defines an opening corresponding to the pattern, and an upper surface of the third portion includes a plane perpendicular to a thickness direction of the deposition mask.

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