-
公开(公告)号：US09499887B2
公开(公告)日：2016-11-22
申请号：US14451117
申请日：2014-08-04
发明人： Ryuichi Inoue , Nozomu Kawabe , Nobuyuki Mori , Masatada Numano , Junichi Matsumoto , Motonori Nakamura , Masayuki Nishizawa , Atsushi Kimura , Yukihiro Oishi
摘要： The invention offers a magnesium alloy sheet having excellent warm plastic formability, a production method thereof, and a formed body produced by performing warm plastic forming on this sheet. The magnesium alloy sheet is produced by giving a predetermined strain to a rolled sheet RS that is not subjected to a heat treatment aiming at recrystallization. The sheet is not subjected to the foregoing heat treatment even after the giving of a strain. The strain is given through the process described below. A rolled sheet RS is heated in a heating furnace 10. The heated rolled sheet RS is passed between rollers 21 to give bending to the rolled sheet RS. The giving of a strain is performed such that the strain-given sheet has a half peak width of 0.20 deg or more and 0.59 deg or less in a (0004) diffraction peak in monochromatic X-ray diffraction. The alloy sheet exhibits high plastic deformability by forming continuous recrystallization during warm plastic forming through the use of the remaining strain.
摘要翻译： 本发明提供一种具有优异的耐热塑性成形性的镁合金板及其制造方法，以及通过在该片上进行热塑性成形而制成的成形体。 通过对未进行再结晶的热处理的轧制板RS给予规定的应变来制造镁合金板。 即使施加了应变，片材也不进行上述的热处理。 通过下述方法给出菌株。 轧制板RS在加热炉10中被加热。加热的轧制板RS在辊21之间通过，以使轧制板RS弯曲。 进行应变的施加使得在单色X射线衍射中的（0004）衍射峰中，应变给定片的半峰宽度为0.20度以上且0.59度以下。 通过使用剩余的应变，通过在热塑性成型期间形成连续的再结晶，合金板表现出高的塑性变形性。
-
公开(公告)号：US10796812B2
公开(公告)日：2020-10-06
申请号：US16084350
申请日：2017-03-14
发明人： Motohiko Sugiura , Issei Okada , Yoshio Oka , Atsushi Kimura , Kenji Ohki
IPC分类号： H01B1/22 , B05D5/12 , C09D7/40 , C09D7/65 , C09D11/52 , H05K1/09 , H01B1/02 , C09D5/24 , C08L79/02
摘要： A coating liquid for forming a conductive layer according to the present invention is a coating liquid for forming a conductive layer, the coating liquid containing fine metal particles, a dispersant, and a dispersion medium. In the coating liquid for forming a conductive layer, the fine metal particles contain copper or a copper alloy as a main component, the dispersant is a polyethyleneimine-polyethylene oxide graft copolymer, a polyethyleneimine moiety in the graft copolymer has a weight-average molecular weight of 300 or more and 1,000 or less, a molar ratio of polyethylene oxide chains to nitrogen atoms in the polyethyleneimine moiety is 10 or more and 50 or less, and the graft copolymer has a weight-average molecular weight of 3,000 or more and 54,000 or less.
-
公开(公告)号：US10887989B2
公开(公告)日：2021-01-05
申请号：US16639270
申请日：2018-08-03
发明人： Tadahiro Kaibuki , Daisuke Sato , Haruna Oya , Yoshiaki Yanagimoto , Atsushi Kimura , Shigeki Shimada
摘要： A printed wiring board of the present invention includes an insulating substrate layer; a first conductive layer laminated to one surface of the substrate layer; a second conductive layer laminated to another surface of the substrate layer; and a via hole formed along an inner surface of a connection hole that is provided, in a thickness direction, through the substrate layer and the first conductive layer, the via hole electrically coupling the first conductive layer and the second conductive layer. A cross-sectional shape of the connection hole along at least one surface of the substrate layer is an irregular shape.
-
-
搜索结果
3 条记录 (耗时 0.012 秒)
