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公开(公告)号：US20250096057A1
公开(公告)日：2025-03-20
申请号：US18827353
申请日：2024-09-06
Applicant: STMicroelectronics International N.V.
Inventor： Michael DE CRUZ , Laurent BARREAU
Abstract: An electronic component includes an integrated circuit chip and a package surrounding the integrated circuit chip. The electronic component includes at least a first conductive region at least partially coating one side of the integrated circuit chip. The first conductive region includes an alloy predominantly comprising bismuth.
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