公开(公告)号：US20250130129A1

公开(公告)日：2025-04-24

申请号：US18915158

申请日：2024-10-14

Applicant: STMicroelectronics International N.V.

Inventor： Filippo DANIELE ,  Enri DUQI ,  Lorenzo BALDO

IPC: G01L19/04 ,  G01L9/00 ,  G01L13/02

Abstract: A pressure sensor has a body having a first chamber and a second chamber hermetically separated from the first chamber; a first detection structure which is arranged in the first chamber, has a first deformable element and a first buried cavity within the first detection structure, wherein the first deformable element is configured to undergo a deformation as a function of a pressure difference between the first chamber and the first buried cavity. The sensor also has a second detection structure which is arranged in the second chamber, has a second deformable element and a second buried cavity within the second detection structure, wherein the second deformable element is configured to undergo a deformation as a function of a pressure difference between the second chamber and the second buried cavity. The sensor also has a first channel that extends into the body and is configured to fluidically couple the first buried cavity with the second chamber; and a second channel that extends into the body and is configured to fluidically couple the second buried cavity to the first chamber.

公开(公告)号：US20240295454A1

公开(公告)日：2024-09-05

申请号：US18117070

申请日：2023-03-03

Applicant: STMicroelectronics International N.V.

Inventor： Lorenzo BALDO ,  Filippo DANIELE ,  Enri DUQI

IPC: G01L9/12

CPC classification number: G01L9/12

Abstract: A pressure-sensor includes a substrate with a cavity therein and a membrane suspended over the cavity. The cavity is connected to external air pressure so a change in external air pressure causes out-of-plane movement of the membrane. A frame suspended over the membrane includes a segment connected to the membrane but disconnected from other frame portions. A projection extends from the frame. A first spring is connected to the projection, a second spring is connected to the segment, and an end portion connects the springs so out-of-plane movement of the membrane applies out-of-plane force to the second spring, which is transferred to the first spring by the end portion and translated to an in-plane force by the first spring and applied to the projection. This causes lateral sliding movement of the frame with respect to the substrate. A capacitive-sensor detects sliding movement of the frame with respect to the substrate.

公开(公告)号：US20220169498A1

公开(公告)日：2022-06-02

申请号：US17534286

申请日：2021-11-23

Applicant: STMICROELECTRONICS S.R.L. ,  STMicroelectronics International N.V.

Inventor： Enri DUQI ,  Lorenzo BALDO ,  Paolo FERRARI ,  Benedetto Vigna ,  Flavio Francesco VILLA ,  Laura Maria CASTOLDI ,  Ilaria GELMI

IPC: B81B7/00

Abstract: A semiconductor device includes: a substrate; a transduction microstructure integrated in the substrate; a cap joined to the substrate and having a first face adjacent to the substrate and a second, outer, face; and a channel extending through the cap from the second face to the first face and communicating with the transduction microstructure. A protective membrane made of porous polycrystalline silicon permeable to aeriform substances is set across the channel.

公开(公告)号：US20240272004A1

公开(公告)日：2024-08-15

申请号：US18108154

申请日：2023-02-10

Applicant: STMicroelectronics International N.V.

Inventor： Enri DUQI ,  Giorgio ALLEGATO

IPC: G01J5/10 ,  B81B7/00 ,  B81C1/00

CPC classification number: G01J5/10 ,  B81B7/0038 ,  B81B7/007 ,  B81C1/00285 ,  B81C1/00301 ,  B81B2201/0278 ,  B81B2207/012 ,  B81B2207/07 ,  B81B2207/097 ,  B81C2203/0109 ,  B81C2203/0792 ,  G01J2005/106

Abstract: Disclosed herein is a method of forming a thermal sensor, including patterning an active layer on a first face of a handle substrate to form a frame, a mass carrying at least one thermally isolated MOS (TMOS) transistor, and a spring structure connecting the mass to the frame while thermally isolating the mass from the frame. The frame is then bonded to pads on a first face of an integrated circuit substrate. The handle substrate is removed, and a top cap is bonded to the first face of the integrated circuit substrate to enclose at least the mass and spring within the sealed cavity.