公开(公告)号：US12048099B2

公开(公告)日：2024-07-23

申请号：US17193702

申请日：2021-03-05

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Pierino Calascibetta

IPC: H05K1/18 ,  H01Q1/22 ,  H01Q9/16 ,  H05K1/11

CPC classification number: H05K1/184 ,  H01Q1/22 ,  H01Q9/16 ,  H05K1/115 ,  H05K1/183 ,  H05K2201/10098 ,  H05K2201/10734

Abstract: A base substrate has a thickness between two faces. The base substrate includes at least one hole extending in a thickness of the base substrate perpendicular to one of the two face. At least one dipole of a surface-mount device type is housed in the at least one hole of the base substrate.