公开(公告)号：US20190267349A1

公开(公告)日：2019-08-29

申请号：US16282594

申请日：2019-02-22

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Marie-Astrid PIN ,  Karine SAXOD ,  Jean-Michel RIVIERE

IPC: H01L23/00 ,  H01L31/0203 ,  H01L33/48 ,  H01L21/78

Abstract: Individual electronic units are formed by cutting a collective assembly. A collective support plate is provided which includes electronic chips. A collective cover plate is provided which includes ribs defining recesses. The collective assembly is formed by mounting the collective cover plate to the collective support plate in a manner where the electronic chips are located in the recesses and the ribs are located between electronic chips. A bead of glue is interposed between ends of the ribs and the surface of the collective support plate. After the glue is hardened, a cutting operation is performed on the collective assembly by cutting through the ribs and the collective support plate to produce the individual electronic units.

公开(公告)号：US20190131481A1

公开(公告)日：2019-05-02

申请号：US16177667

申请日：2018-11-01

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Marie-Astrid PIN ,  Jegger PADERNILLA ,  Jean-Michel RIVIERE

IPC: H01L31/16

Abstract: An encapsulation cover for an electronic package is formed by a first cover body and a second cover body. The first and second cover bodies are assembled together by a bonding material. Frontal walls of the first and second cover bodies are superposed and include through-passages that facing one another and are provided with optical elements allowing light to pass through. At least one surface of the frontal walls of the first and second cover bodies includes void containing the bonding material.