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公开(公告)号：US20210288011A1
公开(公告)日：2021-09-16
申请号：US17195975
申请日：2021-03-09
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Caroline MOUTIN
IPC: H01L23/00 , H01L23/532 , H01L23/528 , H01L21/768
Abstract: An integrated circuit includes an interconnection part formed by a last metal level and at least one protruding solder element disposed on a connection site. The connection site includes a first aluminum sheet connected with the last metal level and at least a second aluminum sheet disposed on the first aluminum sheet and under the protruding solder element.
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