公开(公告)号：US12199131B2

公开(公告)日：2025-01-14

申请号：US17855521

申请日：2022-06-30

Applicant: STMicroelectronics (Crolles 2) SAS

Inventor： Laurent Gay ,  Frederic Lalanne ,  Yann Henrion ,  Francois Guyader ,  Pascal Fonteneau ,  Aurelien Seignard

IPC: H01L27/146

Abstract: Image sensors and methods of manufacturing image sensors are provided. One such method includes forming a structure that includes a semiconductor layer extending from a front side to a back side, and a capacitive insulation wall extending through the semiconductor layer. The capacitive insulation wall includes first and second insulating walls separated by a region of a conductor or a semiconductor material. Portions of the semiconductor layer and the region of the conductor or semiconductor material are selectively etched, and the first and second insulating walls have portions protruding outwardly beyond a back side of the semiconductor layer and of the region of the conductor or semiconductor material. A dielectric passivation layer is deposited on the back side of the structure, and portions of the dielectric passivation layer are locally removed on a back side of the protruding portions of the first and second insulating walls.

公开(公告)号：US11031433B2

公开(公告)日：2021-06-08

申请号：US16270989

申请日：2019-02-08

Applicant: STMicroelectronics (Crolles 2) SAS

Inventor： Frederic Lalanne ,  Laurent Gay ,  Pascal Fonteneau ,  Yann Henrion ,  Francois Guyader

IPC: H01L27/146 ,  H01L21/02 ,  H01L21/306

Abstract: Image sensors and methods of manufacturing image sensors are provided herein. In an embodiment, a method of manufacturing an image sensor includes forming a structure having a front side and a back side. The structure includes a semiconductor layer extending between the front side and the back side of the structure, and a capacitive insulation wall extending through the semiconductor layer between the front side and the back side of the structure. The capacitive insulation wall includes first and second insulating walls separated by a region of a conductive or semiconductor material. The method further includes selectively etching, from the back side of the structure, portions of the semiconductor layer and the region of conductive or semiconductor material, while retaining adjacent portions of the first and second insulating walls.

公开(公告)号：US10446593B2

公开(公告)日：2019-10-15

申请号：US16172044

申请日：2018-10-26

Applicant: STMicroelectronics (Crolles 2) SAS

Inventor： Laurent Gay ,  Francois Guyader

IPC: H01L27/144 ,  H01L27/146

Abstract: An image sensor chip includes a semiconductor layer intended to receive illumination on a back face and comprising a matrix of pixels on a front face. An interconnection structure is arranged on the front face and a carrier is attached to the interconnection structure with a first face of the carrier facing the front face. An annular trench, arranged on a perimeter of the image sensor chip, extends from a second face of the carrier through an entire thickness of the carrier and into the interconnection structure. A via opening, arranged within the annual trench, extends from the second face of the carrier through the entire thickness of the carrier to reach a metal portion of the interconnection structure. The via opening an annual trench are lined with an insulating layer. The via opening include a metal conductor making an electrical connection to the metal portion.

公开(公告)号：US10147748B2

公开(公告)日：2018-12-04

申请号：US15600962

申请日：2017-05-22

Applicant: STMicroelectronics (Crolles 2) SAS

Inventor： Laurent Gay ,  Francois Guyader

IPC: H01L27/144 ,  H01L27/146

Abstract: An image sensor chip includes a semiconductor layer intended to receive illumination on a back face and comprising a matrix of pixels on a front face. An interconnection structure is arranged on the front face and a carrier is attached to the interconnection structure with a first face of the carrier facing the front face. An annular trench, arranged on a perimeter of the image sensor chip, extends from a second face of the carrier through an entire thickness of the carrier and into the interconnection structure. A via opening, arranged within the annual trench, extends from the second face of the carrier through the entire thickness of the carrier to reach a metal portion of the interconnection structure. The via opening an annual trench are lined with an insulating layer. The via opening include a metal conductor making an electrical connection to the metal portion.

公开(公告)号：US11610933B2

公开(公告)日：2023-03-21

申请号：US17327364

申请日：2021-05-21

Applicant: STMicroelectronics (Crolles 2) SAS

Inventor： Frederic Lalanne ,  Laurent Gay ,  Pascal Fonteneau ,  Yann Henrion ,  Francois Guyader

IPC: H01L27/146 ,  H01L21/768 ,  H01L21/02 ,  H01L21/306

Abstract: Image sensors and methods of manufacturing image sensors are provided herein. In an embodiment, a method of manufacturing an image sensor includes forming a structure having a front side and a back side. The structure includes a semiconductor layer extending between the front side and the back side of the structure, and a capacitive insulation wall extending through the semiconductor layer between the front side and the back side of the structure. The capacitive insulation wall includes first and second insulating walls separated by a region of a conductive or semiconductor material. The method further includes selectively etching, from the back side of the structure, portions of the semiconductor layer and the region of conductive or semiconductor material, while retaining adjacent portions of the first and second insulating walls.

公开(公告)号：US20190067342A1

公开(公告)日：2019-02-28

申请号：US16172044

申请日：2018-10-26

Applicant: STMicroelectronics (Crolles 2) SAS

Inventor： Laurent Gay ,  Francois Guyader

IPC: H01L27/144 ,  H01L27/146

CPC classification number: H01L27/1446 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14687

Abstract: An image sensor chip includes a semiconductor layer intended to receive illumination on a back face and comprising a matrix of pixels on a front face. An interconnection structure is arranged on the front face and a carrier is attached to the interconnection structure with a first face of the carrier facing the front face. An annular trench, arranged on a perimeter of the image sensor chip, extends from a second face of the carrier through an entire thickness of the carrier and into the interconnection structure. A via opening, arranged within the annual trench, extends from the second face of the carrier through the entire thickness of the carrier to reach a metal portion of the interconnection structure. The via opening an annual trench are lined with an insulating layer. The via opening include a metal conductor making an electrical connection to the metal portion.

公开(公告)号：US20180145100A1

公开(公告)日：2018-05-24

申请号：US15600962

申请日：2017-05-22

Applicant: STMicroelectronics (Crolles 2) SAS

Inventor： Laurent Gay ,  Francois Guyader

IPC: H01L27/146

CPC classification number: H01L27/1464 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14687

Abstract: An image sensor chip includes a semiconductor layer intended to receive illumination on a back face and comprising a matrix of pixels on a front face. An interconnection structure is arranged on the front face and a carrier is attached to the interconnection structure with a first face of the carrier facing the front face. An annular trench, arranged on a perimeter of the image sensor chip, extends from a second face of the carrier through an entire thickness of the carrier and into the interconnection structure. A via opening, arranged within the annual trench, extends from the second face of the carrier through the entire thickness of the carrier to reach a metal portion of the interconnection structure. The via opening an annual trench are lined with an insulating layer. The via opening include a metal conductor making an electrical connection to the metal portion.