公开(公告)号：US10882738B2

公开(公告)日：2021-01-05

申请号：US16547093

申请日：2019-08-21

Applicant: STMICROELECTRONICS (MALTA) LTD

Inventor： Conrad Cachia ,  David Oscar Vella ,  Damian Agius ,  Maria Spiteri

IPC: B61B7/00 ,  H01L23/00 ,  B81C1/00 ,  B81B7/00 ,  H01L23/31

Abstract: A MEMS device package comprising a first die of semiconductor material including a contact pad and a second die of semiconductor material stacked on the first die. The second die is smaller than the first die. The second die includes a contact pad, and a conductive wire is coupled between the contact pad of the first die and a contact pad of the second die. A mold compound is on the second die and the first die. A vertical connection structure is on the contact pad of the second die. The vertical connection structure extends through the mold compound.

公开(公告)号：US10435290B2

公开(公告)日：2019-10-08

申请号：US15725190

申请日：2017-10-04

Applicant: STMICROELECTRONICS (MALTA) LTD

Inventor： Conrad Cachia ,  David Oscar Vella ,  Damian Agius ,  Maria Spiteri

IPC: B81B7/00 ,  B81C1/00 ,  H01L23/00 ,  H01L23/31

Abstract: A MEMS device having a wafer-level package, is provided with: a stack of a first die and a second die, defining at least a first internal surface internal to the package and carrying at least an electrical contact pad, and at least a first external surface external to the package and defining a first outer face of the package; and a mold compound, at least in part coating the stack of the first and second dies and having a front surface defining at least part of a second outer face of the package, opposite to the first outer face. The MEMS device is further provided with: at least a vertical connection structure extending from the contact pad at the first internal surface towards the front surface of the mold compound; and at least an external connection element, electrically coupled to the vertical connection structure and exposed to the outside of the package, at the second outer face thereof.

公开(公告)号：US09802813B2

公开(公告)日：2017-10-31

申请号：US14860157

申请日：2015-09-21

Applicant: STMICROELECTRONICS (MALTA) LTD

Inventor： Conrad Cachia ,  David Oscar Vella ,  Damian Agius ,  Maria Spiteri

IPC: H01L29/84 ,  B81B7/00 ,  B81C1/00 ,  H01L23/00 ,  H01L23/31

CPC classification number: B81B7/007 ,  B81B2207/098 ,  B81C1/00301 ,  B81C2203/0154 ,  H01L23/3121 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73227 ,  H01L2224/73265 ,  H01L2924/00012 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00

Abstract: A MEMS device having a wafer-level package, is provided with: a stack of a first die and a second die, defining at least a first internal surface internal to the package and carrying at least an electrical contact pad, and at least a first external surface external to the package and defining a first outer face of the package; and a mold compound, at least in part coating the stack of the first and second dies and having a front surface defining at least part of a second outer face of the package, opposite to the first outer face. The MEMS device is further provided with: at least a vertical connection structure extending from the contact pad at the first internal surface towards the front surface of the mold compound; and at least an external connection element, electrically coupled to the vertical connection structure and exposed to the outside of the package, at the second outer face thereof.