公开(公告)号：US20230395449A1

公开(公告)日：2023-12-07

申请号：US18328795

申请日：2023-06-05

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： SeungHyun LEE ,  HyeonChul LEE ,  YuJin HWANG ,  DaYoung KWON

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/3128 ,  H01L21/565 ,  H01L24/32 ,  H01L2924/3025 ,  H01L2224/32225

Abstract: A method for forming a semiconductor device is provided. The method include: providing a package including: a substrate; a stress absorbing layer disposed on a top surface of the substrate; an electronic component mounted on the top surface of substrate; and a first contact pad disposed on the top surface of the substrate and exposed from the stress absorbing layer; providing a mold including: a first cavity exposed from a bottom surface of the mold; and a recess formed adjacent to the first cavity; engaging the mold and the package with the first cavity over the electronic component and the recess between the electronic component and the first contact pad; and injecting encapsulation material into the first cavity to form an encapsulant over the electronic component.