公开(公告)号：US20230326872A1

公开(公告)日：2023-10-12

申请号：US17658240

申请日：2022-04-06

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： KyouYong Han ,  WonJung Kim ,  WoongHui Park

IPC: H01L23/552

CPC classification number: H01L23/552

Abstract: A semiconductor device has a substrate. A first semiconductor die and second semiconductor die are disposed over the substrate. A metal bar has an EMI-absorbing material disposed over the metal bar. The metal bar is disposed over the substrate between the first semiconductor die and second semiconductor die. An encapsulant is deposited over the first semiconductor die, second semiconductor die, and metal bar. A shielding layer is formed over the encapsulant.

公开(公告)号：US12183687B2

公开(公告)日：2024-12-31

申请号：US17658240

申请日：2022-04-06

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： KyouYong Han ,  WonJung Kim ,  WoongHui Park

IPC: H01L23/552 ,  H01L21/56

Abstract: A semiconductor device has a substrate. A first semiconductor die and second semiconductor die are disposed over the substrate. A metal bar has an EMI-absorbing material disposed over the metal bar. The metal bar is disposed over the substrate between the first semiconductor die and second semiconductor die. An encapsulant is deposited over the first semiconductor die, second semiconductor die, and metal bar. A shielding layer is formed over the encapsulant.