公开(公告)号：US20190170459A1

公开(公告)日：2019-06-06

申请号：US16202529

申请日：2018-11-28

Applicant: SPX COOLING TECHNOLOGIES, INC.

Inventor： Eric RASMUSSEN ,  Mark DAVISON ,  Dustin JENKINS ,  John DALTON

IPC: F28F25/10 ,  F28F25/04 ,  F28F25/06 ,  F28C1/02

Abstract: The present disclosure relates to a modular heat exchange tower that has a plurality of air inlet modules each having stanchion disposed therein. The modular heat exchange tower also includes a series of heat exchange modules positioned above the air inlet modules along with a series of plenum modules position above said heat exchange modules.