公开(公告)号：US20190043901A1

公开(公告)日：2019-02-07

申请号：US15737402

申请日：2017-04-11

Applicant: SONY CORPORATION

Inventor： Hideyuki HONDA ,  Tetsuya UCHIDA ,  Toshifumi WAKANO ,  Yusuke TANAKA ,  Yoshiharu KUDOH ,  Hirotoshi NOMURA ,  Tomoyuki HIRANO ,  Shinichi YOSHIDA ,  Yoichi UEDA ,  Kosuke NAKANISHI

IPC: H01L27/146 ,  H04N5/365 ,  H04N5/378

Abstract: The present technology relates to a solid-state imaging element configured so that pixels can be more reliably separated, a method for manufacturing the solid-state imaging element, and an electronic apparatus. The solid-state imaging element includes a photoelectric converter, a first separator, and a second separator. The photoelectric converter is configured to perform photoelectric conversion of incident light. The first separator configured to separate the photoelectric converter is formed in a first trench formed from a first surface side. The second separator configured to separate the photoelectric converter is formed in a second trench formed from a second surface side facing a first surface. The present technology is applicable to an individual imaging element mounted on, e.g., a camera and configured to acquire an image of an object.

公开(公告)号：US20180033809A1

公开(公告)日：2018-02-01

申请号：US15551129

申请日：2016-02-12

Applicant: SONY CORPORATION

Inventor： Hiroshi TAYANAKA ,  Kentaro AKIYAMA ,  Yorito SAKANO ,  Takashi OINOUE ,  Yoshiya HAGIMOTO ,  Yusuke MATSUMURA ,  Naoyuki SATO ,  Yuki MIYANAMI ,  Yoichi UEDA ,  Ryosuke MATSUMOTO

IPC: H01L27/146 ,  H04N5/217 ,  H04N5/378 ,  H04N5/355 ,  H04N5/367 ,  H04N5/374 ,  H04N5/235

CPC classification number: H01L27/146 ,  H01L27/0248 ,  H01L27/14 ,  H04N5/2173 ,  H04N5/2355 ,  H04N5/35554 ,  H04N5/35581 ,  H04N5/3559 ,  H04N5/367 ,  H04N5/374 ,  H04N5/3745 ,  H04N5/378

Abstract: The present technology relates to a solid-state image sensing device and an electronic device capable of reducing noises. The solid-state image sensing device includes: a photoelectric conversion unit; a charge holding unit for holding charges transferred from the photoelectric conversion unit; a first transfer transistor for transferring charges from the photoelectric conversion unit to the charge holding unit; and a light blocking part including a first light blocking part and a second light blocking part, in which the first light blocking part is arranged between a second surface opposite to a first surface as a light receiving surface of the photoelectric conversion unit and the charge holding unit, and covers the second surface, and is formed with a first opening, and the second light blocking part surrounds the side surface of the photoelectric conversion unit. The present technology is applicable to solid-state image sensing devices of backside irradiation type, for example.

公开(公告)号：US20200286937A1

公开(公告)日：2020-09-10

申请号：US16877304

申请日：2020-05-18

Applicant: SONY CORPORATION

Inventor： Hideyuki HONDA ,  Tetsuya UCHIDA ,  Toshifumi WAKANO ,  Yusuke TANAKA ,  Yoshiharu KUDOH ,  Hirotoshi NOMURA ,  Tomoyuki HIRANO ,  Shinichi YOSHIDA ,  Yoichi UEDA ,  Kosuke NAKANISHI

IPC: H01L27/146 ,  H01L21/76 ,  H04N5/365 ,  H04N5/378

Abstract: The present technology relates to a solid-state imaging element configured so that pixels can be more reliably separated, a method for manufacturing the solid-state imaging element, and an electronic apparatus.The solid-state imaging element includes a photoelectric converter, a first separator, and a second separator. The photoelectric converter is configured to perform photoelectric conversion of incident light. The first separator configured to separate the photoelectric converter is formed in a first trench formed from a first surface side. The second separator configured to separate the photoelectric converter is formed in a second trench formed from a second surface side facing a first surface. The present technology is applicable to an individual imaging element mounted on, e.g., a camera and configured to acquire an image of an object.