公开(公告)号：US20230339072A1

公开(公告)日：2023-10-26

申请号：US18302786

申请日：2023-04-19

Applicant: SK enpulse Co., Ltd.

Inventor： Jong Wook YUN ,  Jang Won SEO ,  Su Young MOON ,  Kyung Hwan KIM ,  Tae Kyoung KWON

IPC: B24B53/017

CPC classification number: B24B53/017

Abstract: A conditioning device includes: an ejector for ejecting steam to a rotating polishing pad; and an ejector support supporting the ejector. The ejector includes a plurality of nozzles for ejecting the steam to the polishing pad and a nozzle heater for heating the plurality of nozzles. The nozzle heater is configured to heat nozzles disposed to correspond to a peripheral region of the polishing pad, among the plurality of nozzles, to a higher temperature than nozzles disposed to correspond to a central region of the polishing pad among the plurality of nozzles.