公开(公告)号：US20250065467A1

公开(公告)日：2025-02-27

申请号：US18741785

申请日：2024-06-13

Applicant: SK enpulse Co., Ltd.

Inventor： Mingyeong JI ,  Jongwook YOON ,  Jangwon SEO ,  Suyoung MOON ,  Taeil HONG ,  Eungi MIN

IPC: B24B37/24

Abstract: The present invention relates to an environmentally friendly polishing pad and to a process for preparing the same. The polishing pad prepared from a polyurethane resin comprising a bio-based polymer polyol has excellent environmental friendliness and has physical properties such as hardness and modulus required for a CMP process. Thus, it can be used in the manufacture of semiconductor substrates to demonstrate excellent performance.

公开(公告)号：US20250033160A1

公开(公告)日：2025-01-30

申请号：US18747451

申请日：2024-06-19

Applicant: SK enpulse Co., Ltd.

Inventor： Yujin SHIN ,  Jongwook YOON ,  Jangwon SEO ,  Kyunghwan KIM

IPC: B24B37/22 ,  B24B37/04 ,  H01L21/306

Abstract: In the polishing pad according to an embodiment, the particle size of debris obtained during conditioning and the zeta potential of a debris solution are adjusted to specific ranges. As a result, it is possible to minimize the occurrence of defects and scratches during a CMP process while reducing the size of debris, thereby maintaining excellent physical properties and performance of the polishing pad.