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公开(公告)号：US20230352248A1
公开(公告)日：2023-11-02
申请号：US18346485
申请日：2023-07-03
申请人： SHOEI CHEMICAL INC.
发明人： Soichiro ESAKI
CPC分类号： H01G9/15 , H01G9/012 , H01G9/0425
摘要： A method for manufacturing an electronic component includes: a preparation step of preparing an electrode-forming body for electronic components; and an electrode forming step of forming an electrode on an outer surface of the electrode-forming body for electronic components, wherein in the electrode forming step, a conductive resin layer is formed on the electrode-forming body for electronic components by using a conductive resin composition containing a silicone resin. According to the present invention, it is possible to provide a method for manufacturing an electronic component having high moisture resistance. Alternatively, it is possible to provide a method for manufacturing an electronic component having reduced restrictions on design and manufacturing and high manufacturing efficiency, in addition to high moisture resistance.
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公开(公告)号：US20230343481A1
公开(公告)日：2023-10-26
申请号：US18346538
申请日：2023-07-03
申请人： SHOEI CHEMICAL INC.
发明人： Soichiro ESAKI
摘要： A method for manufacturing an electronic component includes: a preparation step of preparing an electrode-forming body for electronic components; and an electrode forming step of forming an electrode on an outer surface of the electrode-forming body for electronic components, wherein in the electrode forming step, a conductive resin layer is formed on the electrode-forming body for electronic components by using a conductive resin composition containing a metal powder, a resin binder, and an organic solvent, wherein 20.0% by mass or more of the metal powder is a flaky metal powder, and 70.0% by mass or more of the resin binder is a silicone resin. According to the present invention, it is possible to provide a method for manufacturing an electronic component having reduced restrictions on design and manufacturing and high manufacturing efficiency, in addition to high moisture resistance.
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公开(公告)号：US20230170155A1
公开(公告)日：2023-06-01
申请号：US17922577
申请日：2021-04-23
申请人： SHOEI CHEMICAL INC.
发明人： Soichiro ESAKI
CPC分类号： H01G9/15 , H01G9/012 , H01G9/0425
摘要： A method for manufacturing an electronic component includes: a preparation step of preparing an electrode-forming body for electronic components; and an electrode forming step of forming an electrode on an outer surface of the electrode-forming body for electronic components, wherein in the electrode forming step, a conductive resin layer is formed on the electrode-forming body for electronic components by using a conductive resin composition containing a silicone resin. According to the present invention, it is possible to provide a method for manufacturing an electronic component having high moisture resistance. Alternatively, it is possible to provide a method for manufacturing an electronic component having reduced restrictions on design and manufacturing and high manufacturing efficiency, in addition to high moisture resistance.
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公开(公告)号：US20230352249A1
公开(公告)日：2023-11-02
申请号：US18346515
申请日：2023-07-03
申请人： SHOEI CHEMICAL INC.
发明人： Soichiro ESAKI
CPC分类号： H01G9/15 , H01G9/012 , H01G9/0425
摘要： A method for manufacturing an electronic component includes: a preparation step of preparing an electrode-forming body for electronic components; and an electrode forming step of forming an electrode on an outer surface of the electrode-forming body for electronic components, wherein in the electrode forming step, a conductive resin layer is formed on the electrode-forming body for electronic components by using a conductive resin composition containing a silicone resin. According to the present invention, it is possible to provide a method for manufacturing an electronic component having high moisture resistance. Alternatively, it is possible to provide a method for manufacturing an electronic component having reduced restrictions on design and manufacturing and high manufacturing efficiency, in addition to high moisture resistance.
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公开(公告)号：US20230170105A1
公开(公告)日：2023-06-01
申请号：US17922585
申请日：2021-04-23
申请人： SHOEI CHEMICAL INC.
发明人： Soichiro ESAKI
摘要： A method for manufacturing an electronic component includes: a preparation step of preparing an electrode-forming body for electronic components; and an electrode forming step of forming an electrode on an outer surface of the electrode-forming body for electronic components, wherein in the electrode forming step, a conductive resin layer is formed on the electrode-forming body for electronic components by using a conductive resin composition containing a metal powder, a resin binder, and an organic solvent, wherein 20.0% by mass or more of the metal powder is a flaky metal powder, and 70.0% by mass or more of the resin binder is a silicone resin. According to the present invention, it is possible to provide a method for manufacturing an electronic component having reduced restrictions on design and manufacturing and high manufacturing efficiency, in addition to high moisture resistance.
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