公开(公告)号：US10276418B2

公开(公告)日：2019-04-30

申请号：US15109040

申请日：2014-12-26

申请人： SHANGHAI MICRO ELECTRONICS EQUIPMENT CO., LTD.

发明人： Weiwang Sun ,  Gang Wang ,  Chunxia Huang ,  Songli Hu ,  Jie Jiang ,  Ruzhan Lu ,  Jiyuan Mou

IPC分类号： H01L21/67 ,  H01L21/68 ,  H01L21/683 ,  H01L21/687 ,  H01L21/66

摘要： A wafer pre-alignment device is disclosed, including a first unit configured to drive a wafer to rotate or move upward or downward, a second unit configured to drive the wafer to translate, and a position detector including a light source, a lens and an image sensor. A light beam from the light source passes through the wafer and the lens and thereby provides information indicating a position of the wafer to the image sensor. The first unit and the second unit are able to adjust the position of the wafer based on the information obtained by the image sensor. A method for pre-aligning a TSV wafer is also disclosed.