公开(公告)号：US20240203699A1

公开(公告)日：2024-06-20

申请号：US18538919

申请日：2023-12-13

申请人： SEMES CO., LTD.

发明人： Young Jo JIN ,  Dong Young JANG ,  Yun Sang KIM ,  Min Sung JEON ,  Min Hee HONG ,  Young Seo PARK ,  Jeong Sik KIM

IPC分类号： H01J37/32 ,  H01L21/02 ,  H01L21/67

CPC分类号： H01J37/32449 ,  H01J37/32201 ,  H01L21/02274 ,  H01L21/67098 ,  H01L21/67248

摘要： Proposed are a substrate treatment method and a substrate treatment system in which a cooling process with an improved cooling speed and an improved cooling efficiency is applied in a substrate treatment process using an upper heat source. A substrate treatment method etching a substrate at an atomic layer level by using a processing unit and a thermal treatment unit may be provided. The substrate treatment method includes a surface treatment process in which a substrate surface is modified in the processing unit, a desorption process in which the substrate surface-treated in the processing unit is heated by the upper heat source in the thermal treatment unit, thereby generating a desorption reaction on the substrate surface, and a temperature adjustment process in which the substrate is cooled by a cooling plate in the thermal treatment unit, thereby maintaining a temperature of the substrate at a set temperature range.

公开(公告)号：US20240213001A1

公开(公告)日：2024-06-27

申请号：US18542776

申请日：2023-12-18

申请人： SEMES CO., LTD.

发明人： Young Jo JIN ,  Sang Jeong LEE ,  Min Sung JEON ,  Tae Hwan LEE ,  Min Hee HONG

IPC分类号： H01J37/32 ,  H01L21/3065 ,  H01L21/687

CPC分类号： H01J37/32724 ,  H01J37/32522 ,  H01L21/30655 ,  H01L21/68742 ,  H01J2237/3341

摘要： Proposed are a substrate treatment method and a substrate treatment apparatus that are capable of adjusting cooling efficiency for a substrate. According to an embodiment of the present disclosure, there may be provided the substrate treatment method including a heating process in which a surface of the substrate is heated and a cooling process in which the substrate is cooled by supplying a cooling gas to a lower surface of the substrate. Furthermore, the cooling process includes a cooling condition controlling process in which a cooling condition is controlled.