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公开(公告)号：US11101052B2
公开(公告)日：2021-08-24
申请号：US16331965
申请日：2017-09-21
发明人： Sayaka Wakioka , Hidefumi Yasui , Shuujirou Sadanaga , Masahiro Itou , Shike Sou , Yuta Yamanaka
IPC分类号： H01B1/22 , H01B1/00 , H01R11/01 , C08K5/09 , C08K5/49 , H01B5/16 , C08L101/00 , C08K3/10 , C08K3/11 , C08L63/00
摘要： There is provided a conductive material in which, even when a conductive material is left for a certain period of time, solder of conductive particles can be efficiently placed on an electrode, and, in addition, even if an electrode width and an inter-electrode width are narrow, occurrence of migration can be effectively suppressed, and generation of voids can be effectively suppressed. The conductive material according to the present invention contains a plurality of conductive particles in which an outer surface portion of a conductive portion comprises solder, a thermosetting compound, an acid anhydride thermosetting agent, and an organophosphorus compound.
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2.发明申请公开(公告)号：US20190252089A1
公开(公告)日：2019-08-15
申请号：US16331965
申请日：2017-09-21
发明人： Sayaka Wakioka , Hidefumi Yasui , Shuujirou Sadanaga , Masahiro Itou , Shike Sou , Yuta Yamanaka
CPC分类号： H01B1/22 , C08K3/10 , C08K3/11 , C08K5/09 , C08K5/49 , C08L63/00 , C08L101/00 , H01B1/00 , H01B5/16 , H01R11/01
摘要： There is provided a conductive material in which, even when a conductive material is left for a certain period of time, solder of conductive particles can be efficiently placed on an electrode, and, in addition, even if an electrode width and an inter-electrode width are narrow, occurrence of migration can be effectively suppressed, and generation of voids can be effectively suppressed. The conductive material according to the present invention contains a plurality of conductive particles in which an outer surface portion of a conductive portion comprises solder, a thermosetting compound, an acid anhydride thermosetting agent, and an organophosphorus compound.
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3.发明申请公开(公告)号：US20190206587A1
公开(公告)日：2019-07-04
申请号：US16325934
申请日：2017-08-30
发明人： Shike Sou , Masahiro Itou , Shuujirou Sadanaga
CPC分类号： H01B1/22 , C08K3/16 , C08K2201/001 , C08L101/12 , C09J9/02 , H01B1/00 , H01B1/02 , H01B5/16 , H01R11/01
摘要： The present invention provides a conductive material in which, even when the conductive material is left for a certain period of time, solder of conductive particles can be efficiently placed on an electrode, and, in addition, yellowing of the conductive material can be sufficiently suppressed during heating. The conductive material according to the present invention contains a plurality of conductive particles having solder at an outer surface portion of a conductive portion, a curable compound, and a boron trifluoride complex.
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