-
公开(公告)号：US20200254704A1
公开(公告)日：2020-08-13
申请号：US16786148
申请日：2020-02-10
摘要： A method of manufacturing an electronic device in which an electronic component coupled to a lead is covered with a mold cover, includes: a coupling step of coupling the electronic component to the lead, a bending step of bending the lead to adjust a posture of the electronic component, and a molding step of molding the electronic component with a resin material to form the mold cover, and the bending step includes a lead bending step of bending the lead by pressing a pressing member against the lead without pressing the pressing member against the electronic component.
-
公开(公告)号：US20240159534A1
公开(公告)日：2024-05-16
申请号：US18506424
申请日：2023-11-10
发明人： Masataka KAZUNO , Kenji YAMAMOTO
IPC分类号： G01C19/5733 , H03H9/05 , H03H9/10 , H03H9/215
CPC分类号： G01C19/5733 , H03H9/0542 , H03H9/0552 , H03H9/105 , H03H9/215
摘要： An electronic device includes a substrate, a first electronic component mounted on the substrate and including a first vibrator element vibrating along a first plane along the substrate, a second electronic component mounted on the substrate and including a second vibrator element vibrating along a second plane crossing the first plane, a third electronic component mounted on the substrate and including a third vibrator element vibrating along a third plane crossing the first plane and the second plane, and a cap mounted on the substrate and covering the first electronic component, the second electronic component, and the third electronic component, wherein a resonance mode of the cap is not within vibration frequency bands of the second vibrator element and the third vibrator element in an operation temperature range.
-
搜索结果
2 条记录 (耗时 0.012 秒)
